It is imperative to replace the hottest semiconduc

Semiconductor materials: localization and substitution are imperative

the development of integrated circuits in the world has experienced three stages: the monopoly of the United States and Europe, the rise of Japan and the dominance of the Asia Pacific. Because Chinese Mainland has the advantages of low labor costs, huge market demand and gradually improving the industrial chain, the scale of the semiconductor market is gradually increasing

in the field of semiconductor raw materials, integrated circuit technology has developed to the physical limit of micro nano electronic system. The upper computer sends speed instructions to the electromechanical control card through software. Relying solely on feature size reduction is not enough to achieve the technical development goal

with the continuous development of micro and nano manufacturing technology, strict requirements are put forward for the purity of materials, nano precision size control, and the functionality of materials

according to semi, the global semiconductor material market (including wafer manufacturing materials and packaging materials) reached US $52.14 billion in 2019, a year-on-year decrease of 1.1%

among them, the market scale of wafer manufacturing materials was 32.8 billion, a year-on-year decrease of 0.4%. With advanced wafer OEM and packaging technology, Taiwan, China, China, has been the largest consumer of semiconductor materials in the world for ten consecutive years. In 2019, with the overall scale of the global semiconductor material Market declining slightly, only Chinese Mainland among the top six semiconductor material consumption regions increased by 1.9%

semiconductor tensile testing machine control advantages the material industry changes are highly consistent with the development process of global integrated circuits, and the industry has an obvious trend of eastward movement, and gradually concentrated in Chinese Mainland

semiconductor materials are mainly used in front-end wafer manufacturing and back-end chip packaging

according to the semiconductor manufacturing process, the materials required for semiconductor manufacturing are mainly distributed in the following four steps:

1 Doping/heat treatment: sputtering target, wet chemical, chemical gas, CMP polishing pad and polishing liquid; 2. Etching/cleaning: Mask/mask, sputtering target, CMP polishing pad and polishing liquid; 3. Deposition: chemical gas, CMP polishing pad and polishing fluid; 4. Lithography: Mask/mask, photoresist, photoresist developer, flux, stripper. We should all check regularly. The highest proportion is silicon wafer 35%, special gas 17% and mask 15%

the semiconductor materials required for different wafer foundry and packaging links are different. For example, the initial raw materials for wafer processing links are silicon wafers (6 inches, 8 inches, 12 inches, etc.), and silicon wafers account for about 38% of the cost of semiconductor materials

packaging materials include lead frames, but can be compared through experiments, packaging substrates, ceramic substrates, bonding wires, packaging materials, chip bonding materials, etc

silicon wafer, photoresist, CMP polishing materials and other materials are the most upstream links of the industrial chain. Domestic substitution has just begun, and there is huge space in the future

semiconductor materials are one of the weakest links in China's semiconductors, which are highly dependent on imports. The self-sufficiency rate of most domestic products is low, basically less than 30%, and most of them are packaging materials with low technical barriers. In terms of wafer manufacturing materials, the localization proportion is lower, which mainly depends on imports

referring to China's industrial information, the market share of the top six companies in the global silicon wafer market is more than 90%, the market share of the top five companies in the global photoresist market is more than 80%, the market share of the top six companies in the global high-purity reagent market is more than 80%, and the market share of the top seven companies in the global CMP material market is more than 90%

because IC materials account for a small proportion of downstream costs, but have a great impact on product performance, downstream customers are not very sensitive to product price, pay more attention to product quality and stability, and there are high technical barriers

in addition, domestic semiconductor material enterprises are concentrated on production lines below 6 inches. At present, a few manufacturers have begun to enter domestic 8-inch and 12 inch production lines

domestic leading semiconductor material manufacturers represented by Anji technology and Shanghai silicon industry have made important breakthroughs in their fields and broken foreign monopolies. For example, Anji technology CMP chemical mechanical polishing fluid has achieved large-scale sales in nm technology node, which is mainly used in domestic 8-inch and 12 inch mainstream wafer production lines, and nm technology node products are also being developed

there are 49 certified customers of 300mm semiconductor silicon wafer in Shanghai silicon industry, and 4 new customers of products under certification. Among them, some products of 300mm semiconductor silicon wafer have been certified by core chip manufacturing enterprises such as grofangde, Huahong Hongli, Huali microelectronics, Changjiang storage, and China Resources Microelectronics (as of September 30, 2019)

although semiconductor materials need long-term research and development, mass production and experience accumulation, and it is difficult to replace them, it is imperative for China to realize "independent control" of integrated circuit manufacturing, and localization and replacement of semiconductor materials